Prof. Shi-Wei Ricky Lee

Hong Kong University of Science and Technology

Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for three years. Currently Dr Lee is Chair Professor of Mechanical and Aerospace Engineering (MAE) and Director of HKUST Foshan Research Institute for Smart Manufacturing (FRISM) at HKUST. He also has concurrent appointments as Acting Dean of Systems Hub of HKUST Guangzhou campus, Executive Director of HKUST Shenzhen Platform Development Office, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Dr Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. His R&D activities cover wafer level packaging for heterogeneous integration, additive manufacturing for microsystems, LED packaging, and reliability engineering. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 3 books and 9 book chapters. Due to his technical contributions, Dr Lee received many honours and awards over the years. Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and Institute of Physics (UK). He also serves as Editor-in-Chief of ASME Journal of Electronic Packaging.

Research Foucs: 3D IC Integration; Microsystems Packaging; Reliability Analysis; Additive Manufacturing

Prof. Damena Agonafer

University of Maryland

Professor Agonafer earned his PhD at the University of Illinois Urbana-Champaign, where he was supported by the Alfred P. Sloan fellowship, Graduate Engineering Minority Fellowship, and NSF Center of Advanced Materials for Purification of Water with Systems (WaterCAMPWS). After his PhD, Damena joined Professor Ken Goodson’s Nanoheat lab as a Postdoctoral Scholar in the Mechanical Engineering Department at Stanford University. Prior to joining University of Maryland, Damena was an Assistant Professor in the Department of Mechanical Engineering at Washington University in Saint Louis. He is a recipient of the Google Research Award, Sloan Research Fellowship Award, Cisco Research Award, NSF CAREER Award, ASME Early Career award, and ASME K-16 Outstanding Early Faculty Career in Thermal Management Award. He was also one of 85 early-career engineers in the US selected to attend the 2021 National Academy of Engineering's 26th annual US Frontiers of Engineering symposium. Professor Agonafer is a faculty member of the Center for Advanced Life Cycle Engineering (CALCE) and Maryland Energy Innovation Institute.

Research Interests: Professor Agonafer’s research interest is at the intersection of thermal-fluid sciences, interfacial transport phenomena, and renewable energy. He is focused on developing novel materials and systems for thermal management of power and microelectronic systems, as well as for thermochemical and electrochemical energy storage applications. His goal is to achieve transformational changes in technologies by tuning and controlling solid-liquid-vapor interactions at micro-/nano length scales. Specific areas of focus include the development of novel materials and micro-/nanostructures for phase change heat transfer, thermochemical energy storage, and interfacial transport phenomena. Applications of his work include cooling high-powered electronics, battery thermal management, and data center cooling, and improving the efficiency of HVAC systems.

Prof. K. N. Chiang

National Tsing Hua University

Professor K. N. Chiang received his PhD from the Georgia Institute of Technology, USA. He is the Chair Professor at the National Tsing Hua University in Hsinchu, Taiwan. From 2010 to 2013, he served as General Director of the National High-Performance Computing Center, which is the National Strategic Research Center of Taiwan. He has received three times outstanding research awards from the Ministry of Science and Technology of Taiwan and has published more than 400 technical papers in international journals and conference proceedings. He has been awarded more than 50 invention patents. He is the IEEE / ASME / STAM / iMAPS Fellow and the International Academy of Engineering (IAE) Academician.

Prof. Sukwon Choi

The Pennsylvania State University

Sukwon Choi is an Associate Professor of Mechanical Engineering at the Pennsylvania State University. He received the Ph.D. degree in mechanical engineering from Georgia Institute of Technology in 2013. Then he worked at Sandia National Laboratories as a postdoctoral appointee (2013-2015) and received the NNSA Defense Programs Awards of Excellence (2014). At Penn State, he received the AFOSR Young Investigator Award (2016) and was awarded the Kenneth K. and Olivia J. Kuo Early Career Professorship (2018). His current research interests include micro/nanoscale thermal characterization, electro-thermal analysis and thermal management of microelectronics and MEMS, and semiconductor device reliability.

Research Focus: Electro-thermal Modeling; Device-level Thermal Management; Micro/nanoscale Heat Transfer; Thermal Characterization; Wide Bandgap Semiconductors and Devices

Dr. Ercan M. Dede

Toyota Research Institute of North America

Ercan (Eric) Dede received his BS degree and PhD in mechanical engineering from the University of Michigan and an MS degree in mechanical engineering from Stanford University. Currently, he is the Director of the Electronics Research Department at the Toyota Research Institute of North America. His team focuses on vehicle systems involving advanced sensors, power semiconductors, electronics and photonics packaging, and thermal management technology. He has over 155 issued patents and has published more than 100 articles in archival journals and conference proceedings on topics related to design and structural optimization of thermal, mechanical, and electromagnetic systems. He is an author of a book entitled “Multiphysics Simulation: Electromechanical System Applications and Optimization.” His team has received two R&D 100 Awards for the development of technologies related to next-generation electronics for electrified vehicles. He currently serves as an Associate Editor for the ASME Journal of Electronic Packaging.

Research Focus: Multiphysics Design Optimization, Electronics Cooling, Finite Element Methods, Thermal Composites / Metamaterials, Power Electronics

Prof Dr Ir Willem D. van Driel

Signify/TU Delft

Willem van Driel graduated as a mechanical engineering at Technical University of Eindhoven and received a PhD degree from Delft University of Technology, the Netherlands. He has a >25 year track record in the reliability domain. Application areas range from healthcare, gas and oil explorations, semiconductors. His current position is Fellow Scientist at Signify (formerly Philips Lighting). Besides that he holds a professor position at the University of Delft, The Netherlands. His scientific interests are solid state lighting, microelectronics and microsystems technologies, virtual prototyping, virtual reliability qualification and designing for reliability of microelectronics and microsystems. He is chair of the organizing committee of the IEEE conference EuroSimE. He has authored and co-authored more than 350 scientific publications, including journal and conference papers, book or book chapters and invited keynote lectures.

Research Focus: Solid State Lighting, Microelectronics and Microsystems Technologies, Virtual Prototyping, Virtual Reliability Qualification, Designing for Reliability

Prof. Wei Li

Zhejian University

Dr. Wei Li has published over 200 peer reviewed papers on studies of thermal systems. His research experience include experimental, numerical and theoretical studies on a wide variety of fundamental and applied topics: two phase heat transfer, falling film evaporation, fouling, chemical reaction flow, compact heat exchangers, air conditioning, chemico-physical characteristics of heat-transfer surfaces, and so on. He has been the first ASME Fellow in Heat Transfer elected when serving as a full-time professor in China so far.

Research Focus: Micro Enhanced Heat Transfer, Two-Phase Flow, Compact Heat Exchangers, Chemico-Physical Characteristics of Nano-Scale Heat-Transfer Surfaces

Prof. Amy Marconnet

Purdue University

Amy Marconnet is an Associate Professor of Mechanical Engineering at Purdue University. She received a B.S. in Mechanical Engineering from the University of Wisconsin – Madison in 2007, and an M.S. and a PhD in Mechanical Engineering at Stanford University in 2009 and 2012, respectively. During her studies, she won the Brit and Alex d’Arbeloff Stanford Graduate Research Fellowship, an NSF Graduate Research Fellowship, the MRS Graduate Student Silver Award, and the outstanding paper award in the Thermal Track at ITherm 2012. She then worked briefly as a postdoctoral associate at the Massachusetts Institute of Technology, before joining the faculty at Purdue University in August 2013 as an Assistant Professor. She was promoted to Associate Professor in August 2019. At Purdue, Dr. Marconnet has made significant contributions to the field of heat transfer developing an interdisciplinary research program to evaluate, understand, and control the physical mechanisms governing the thermal transport properties of materials, machines, and systems. Her research group has made significant advances to the development of novel metrology tools for characterizing transport properties, enhanced understanding of fundamental transport and energy conversion mechanisms, and strategic, physics-based design and development of materials with multi-functional capabilities. In 2017, she won the Woman Engineer of the Year Award from the ASME Electronics & Photonics Packaging Division and, in 2020, she was recognized as the Outstanding Graduate Student Mentor for Mechanical Engineering by the College of Engineering at Purdue and the Bergles-Rohsenow Young Investigator Award in Heat Transfer from ASME. Her team has also won outstanding paper awards at InterPACK 2017 and ITherm 2019.

Research Focus: Heat Transfer, Energy Conversion, Nanoscale Materials, Electronic Packaging, Thermal Metrology

Dr. Sreekant Narumanchi

Center of Integrated Mobility Sciences, NREL

Sreekant Narumanchi is the Group Manager of the Advanced Power Electronics and Electric Machines (APEEM) Group within the Center of Integrated Mobility Sciences at the National Renewable Energy Laboratory, where he is currently in his 19th year. He leads a Group of 15 researchers focused on electro-thermal, thermal-fluids, thermo-mechanical and reliability aspects of power electronics and electric machines. This includes investigation of various cooling technologies, thermal interface materials/interfaces, interconnects, as well as reliability of these components. Over the years, his Group has collaborated with more than 70 institutions cutting across industry, universities, national labs, and other research institutions.

Sreekant is an ASME Fellow, an IEEE Senior Member, and has published over 105 peer-reviewed journal and conference papers. Professionally, he is active as an Associate Editor for the ASME Journal of Electronic Packaging, as an organizer for the ASME InterPACK (including as General Chair in 2019) and IEEE ITherm conferences, on the ASME K-16 Committee on Heat Transfer in Electronic Equipment, and as an Associate Editor of the IEEE Components, Packaging, and Manufacturing Technologies Journal. He is part of the Executive Committee of the ASME Electronic and Photonic Packaging Division, and serves as the Chair of the IEEE Electronic Packaging Society Thermal-Mechanical Technical Committee. Also, Sreekant is part of the Thermal Working Group of the IEEE Heterogeneous Integration Roadmap Committee. He serves on the Scientific Advisory Board of the POETS NSF Engineering Research Center, on the External Advisory Board of the Washington State University School of Mechanical and Materials Engineering, as well as a reviewer for numerous journals and federal agencies.

Some of the external awards Sreekant has received include the 2022 THERMI Award, the 2020-21 Associate Editor of the Year Award from the ASME Journal of Electronic Packaging, 2018 ASME EPPD-K16 Clock Award, a 2016 R&D 100 Award, the Best Paper Award from the ASME Journal of Electronic Packaging (2003), and the ASME 2013 InterPACK Conference Outstanding Paper Award. Within NREL, he received the 2013 NREL Outstanding Business Collaboration Award, and the 2009 NREL Staff Award for Outstanding Performance. Sreekant received a Ph.D. from Carnegie Mellon University (2003), M.S. from Washington State University (1999), and B. Tech. from Indian Institute of Technology Kanpur (1997), all in Mechanical Engineering.

Research Focus: Heat Transfer, Thermal Management, Reliability, Advanced Packaging, Power Electronics and Electric Machines

Prof. Ming-Yi Tsai

Chang Gung University

Ming-Yi Tsai received a B.S. degree from the National Cheng Kung University, Taiwan, in 1982, and the M.S. and Ph. D. degrees in engineering science and mechanics from the Virginia Polytechnic and State University (Virginia Tech), Blacksburg, VA, 1988, and 1990, respectively. He is currently a Professor at the Department of Mechanical Engineering, Chang Gung University, Taiwan. He has published over 150 technical papers in journals and conferences. His research interest is in electronic/optoelectronic packaging, photomechanics, adhesive bonding, and mechanics of composite materials.

Research Focus: Thermo-mechanics in Electronic/Optoelectronic Packaging, Photo-mechanics, Adhesive Bonding, Mechanics of Composite Materials

Prof. Ronald Warzhoa

Johns Hopkins University Applied Physics Laboratory

Dr. Ronald Warzoha is a Senior Research Scientist at the Johns Hopkins University Applied Physics Laboratory. He was previously an Associate Professor at the United States Naval Academy. His research interests lie at the intersection of nanoscale thermal transport, electronics packaging/renewable energy systems, and materials science. Dr. Warzoha has written over 40 peer reviewed journal publications, holds a number of distinguished teaching and research awards, and is recognized as a leader within the ASME K-16 community.

Research Focus:Nanoscale/microscale Heat Transfer; Thermal Management; Power Electronics; Phase Change Materials / Rewriteable Media

Dr. Jin Yang

Samsung Semiconductor

Dr. Jin Yang is a Senior Principal Engineer with Samsung Semiconductor. Prior to that, he worked for Intel Corporation and NXP Semiconductor in advanced IC packaging. He has over 15 years of experience in microelectronic backend manufacturing, advanced IC packaging, and silicon-package-platform level thermal management. His research interests include 2.5D/3D IC packaging, assembly and manufacturing process, wafer sort and test, and package quality inspection & reliability.

Research Focus: 2.5D/3D IC Packaging, Electronic Package Assembly and Manufacturing; Reliability & Inspection of Electronic Packages; Package and Component Thermal Management; Wafer Test; Known Good Die.