InterPACK 2021 Special Issue Lead Assoicate Editor
Dr. Jin Yang
Intel Corporation
Dr. Jin Yang is a senior staff and architecture with Intel Corporation. He has over 15 years of experiences in microelectronic backend manufacturing, advanced electronic packaging, and package/silicon level thermal management. His current research interests include advanced electronic package architecture, 3D package integration, assembly and manufacturing process, wafer sort and test, and package quality inspection & reliability.
Research Focus: Electronic Package Assembly and Manufacturing; Reliability & Inspection of Electronic Packages; Package and Component Thermal Management; Wafer Test; Known Good Die.
InterPACK 2021 Special Issue Guest Editors
Prof. Sukwon Choi
Pennsylvania State University
Sukwon Choi is an Assistant Professor of Mechanical Engineering at the Pennsylvania State University. He received the B.S. and M.S. degree in mechanical engineering (2005) and automotive engineering (2007), respectively, from Hanyang University, Seoul, Korea. He was with GS FuelCell Co., Ltd., Seoul, Korea in 2007. He received the Ph.D. degree in mechanical engineering from Georgia Institute of Technology in 2013. Then he worked at Sandia National Laboratories as a postdoctoral appointee (2013-2015) and received the NNSA Defense Programs Awards of Excellence (2014). His current research interest includes nanoscale thermal characterization, electro-thermal analysis of wide bandgap electronics and piezoelectric MEMS, thermal management of microelectronics, and semiconductor device reliability. At Penn State, he received the AFOSR Young Investigator Program Award (2016) and recently awarded the Kenneth K. and Olivia J. Kuo Early Career Professorship (2018).
Research Focus: Electro-thermal Modeling; Device-level Thermal Management; Micro/nanoscale Heat Transfer; Thermal Characterization; Wide Bandgap Semiconductors and Devices