About JEP

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

The journal publishes papers that address 1) thermal management, applied mechanics and technologies for microsystems packaging; 2) critical issues in systems integration; 3) emerging packaging technologies and materials with micro/nano structures; and 4) general small scale systems.

The journal serves researchers and engineers working in academic and industrial settings. In addition, leaders in the field are invited to publish review articles on hot, emerging and fundamental topics.

Scope:
  • Electronic Packaging
  • Thermal Management
  • Applied Mechanics
  • Microsystems Packaging
  • Reliability Analysis
  • Systems Integration
  • Small Scale Systems in General

    • General Enquiry:

    Dr. Jeffery C. C. LO, Assistant to the Editor
    Miss Qiawen XU, Student Helper
    Tel: (852) 2358 8356
    Fax: (852) 2358 8357
    Email: asmejep@ust.hk

    Linkedin     WeChat    Twitter

    ASME JEP InterPACK 2023 Special Issue Call for Papers

    InterPACK is a premier international forum for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging and micro/nano-electromechanical systems. It is also the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The Journal of Electronic Packaging (JEP) publishes papers that use experimental and theoretical methods, approaches, and techniques to address and solve various mechanical, materials, thermal, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. 

    Authors are invited to submit their manuscripts revised from their original conference papers to be considered for the Special Issue. These papers will be reviewed by the AE/GE and go through the normal JEP review process. Presentation-only contributors are also invited to develop full-length manuscripts and submit them for review. The aim of this InterPACK Special Issue is to publish outstanding papers with a diversity of scientific works representing all tracks of InterPACK2023.

    Submission Instructions
    1. The SI is targeted to publish honorary-quality papers with InterPACK2023 flavor, but it’s not equivalent to conference proceedings.
    2. Please revise an original InterPACK2023 conference paper with new contents to meet “similarity” requirement of <50% compared to original conference paper.
    3. The submission should be directly revised from the InterPACK2023 paper or technical presentation. Please include the original InterPACK paper in the appendix of your submission to this SI through the ASME Journal Tool. 

    Should you have any questions, please contact Prof. Ron Warzoha at Ronald.Warzoha@gmail.com.


    Initial electronic manuscript submission: January 31, 2024
    Target publication date of Special Issue: September 2024

    Lead Assoicate Editor: Prof. Ron Warzoha (United States Naval Academy)
    Guest Editors: Prof. Ashutosh Giri (University of Rhode Island), Damena Agonafer (University of Maryland), Dr. Jimil Shah (Stealth Startup)

    2023 Top 10 Downloads

    Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

    John H. Lau

    Total Views: 16,025

    Link
    Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

    Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee

    Total Views: 10,803

    Link
    Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

    Asisa Kumar Panigrahy, Kuan-Neng Chen

    Total Views: 10,131

    Link
    Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

    Justin Broughton, Vanessa Smet, Rao R. Tummala, Yogendra K. Joshi

    Total Views: 8,504

    Link
    A Review on Laser Processing in Electronic and MEMS Packaging

    Kaysar Rahim, Ahsan Mian

    Total Views: 8,280

    Link
    A Review on Transient Thermal Management of Electronic Devices

    John Mathew, Shankar Krishnan

    Total Views: 7,091

    Link
    Thermal Metamaterials for Heat Flow Control in Electronics

    Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

    Total Views: 6,556

    Link
    Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions

    Richard Eiland, John Edward Fernandes, Marianna Vallejo, Ashwin Siddarth, Dereje Agonafer, Verrendra Mulay

    Total Views: 5,682

    Link
    Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

    Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt

    Total Views: 5,416

    Link
    Technological Advances to Maximize Solar Collector Energy Output: A Review

    Swapnil S. Salvi, Vishal Bhalla, Robert A. Taylor, Vikrant Khullar, Todd P. Otanicar, Patrick E. Phelan, Himanshu Tyagi

    Total Views: 5,321

    Link
    Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

    Ruina Xu, Gaoyuan Wang, Peixue Jiang

    Total Views: 5,317

    Link

    Open Access Articles

    Failure Analysis of Direct Liquid Cooling System in Data Centers

    Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia

    Download
    Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

    Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi

    Download
    Challenges in Three-Dimensional Printing of High-Conductivity Copper

    Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt

    Download
    Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

    Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

    Download
    Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery

    Aaron Knobloch, Chris Kapusta, Jason Karp, Yuri Plotnikov, Jason B. Siegel, Anna G. Stefanopoulou

    Download
    Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

    Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi

    Download
    Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

    Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet

    Download
    Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

    Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee

    Download